What We Do

The following examples are all individual packages, but almost everything we do is in large arrays. Because we are an assembly house, please consider these as examples. If you don't find what your looking for, give us a call.

Ceramic Packages

We have had excellent success with ceramic packages. There is little argument that the circuit characteristic of a ceramic package is superior to plastic, but ceramic has the reputation of being expensive. This may be true for larger ICs, but is often not true for smaller ICs. And the benefits of ceramic continue throughout the life of an IC with superior MSL capabilities during PCB manufacturing and also superior heat transfer capabilities to improve the reliability of the IC. Give us a call and test us on this. Take advantage of the cost, performance, and reliability of air cavity IC packages.

Moisture sensitivity: JEDEC Level 1 (insensitive) Inherently lead free No materials in contact with die surface. Optimum for MEMs, SAWs, Optics Small packages have costs similar to plastic Superior high frequency RF performance

Plastic Molded Packages

Traditional overmolded plastic, or more recent air cavity plastic package assembly is available.

2mm up to 12mm JEDEC MO-220 compliant Low cost QFN leadframe QFN laminate (multi-chip) QFN plastic air cavity on leadframe or laminate

If a specific footprint is required, it only adds a few days to the first manufacturing run. This package technology provides a great platform for multichip and Systems in Package(SIP)products.

Low Power, Power Packages

Micro X and small ceramic QFN packages for GaAs amplifiers have long been a specialty for us.

1.5mm up to 5mm Micro X and JEDEC MO-220 compliant Low cost

High Power Packages

For Bi-polar, LDMOS, and even newer technologies that require precise die placement and bond wire shaping.